Ikozvino sensor bracket
Product Parameter
* Zvinhu: PBT + silicon simbi pepa + copper alloy
*Core tekinoroji: core stamping lamination, kupisa kupisa, pini musangano kukotama, musimboti/pini kuumba/bushing jekiseni kuumba
*Technical parameters:
* Kupisa uye kutonhora kuvhunduka mamiriro: -40 ℃-125 ℃ 168 cycles, akatevedzana tembiricha kutenderera -40 ℃-125 ℃ 485 kutenderera;
* High tembiricha kuchembera: 125 ℃ 1340 maawa
* Yakadzika tembiricha kuchengetedza: -40 ℃ 168 maawa
*Tembiricha uye hunyoro mamiriro: kaviri 85 240 maawa
*Isulation inomira voltage: DC4100V/10s, kuvuza ikozvino ≤0.2mA
* giredhi rinodzosa moto: UL94-V0
Product Parameter
* Zvinhu: PBT + silicon simbi pepa + copper alloy
*Core tekinoroji: core stamping lamination, kupisa kupisa, pini musangano kukotama, musimboti/pini kuumba/bushing jekiseni kuumba
*Technical parameters:
* Kupisa uye kutonhora kuvhunduka mamiriro: -40 ℃-125 ℃ 168 cycles, akatevedzana tembiricha kutenderera -40 ℃-125 ℃ 485 kutenderera;
* High tembiricha kuchembera: 125 ℃ 1340 maawa
* Yakadzika tembiricha kuchengetedza: -40 ℃ 168 maawa
*Tembiricha uye hunyoro mamiriro: kaviri 85 240 maawa
*Isulation inomira voltage: DC4100V/10s, kuvuza ikozvino ≤0.2mA
* giredhi rinodzosa moto: UL94-V0
Product Parameter
*Zvinhu: PA66+PA6T+silicon simbi pepa+T2Y2 mhangura
* Core tekinoroji: magnetic core stamping lamination, kupisa kupisa, copper busbar stamping/ kukotama, copper busbar molding injection molding, magnetic core assembly molding
*Technical parameters:
* Kupisa uye kutonhora kuvhunduka mamiriro: -40 ℃-105 ℃ 500 kutenderera
* High tembiricha kuchembera: 105 ℃ 1340 maawa
* Yakadzika tembiricha kuchengetedza: -40 ℃ 168 maawa
*Tembiricha uye hunyoro mamiriro: kaviri 85 240 maawa
* Insulation inomira voltage: AC4500V/60s, kuvuza ikozvino ≤5mA
* Insulation impedance: 1000MΩ, DC500V
* giredhi rinodzosa moto: UL94-V0
