Electronic control copper bar assembly

Product Parameter
*Material: T2M copper foil (thickness 0.1mm), T2Y2 copper busbar, plastic PBT+GF30, nanocrystalline magnetic ring, AB potting glue
*Core technology: stamping, resistance brazing, injection molding, nanocrystalline magnetic ring potting
*Technical parameters:
*Hot and cold shock conditions: -40℃-125℃, 2 hours per cycle, 150 cycles;
*High temperature aging: 125℃1920 hours
*Insulation withstand voltage: 3000VAC, 60s, leakage current <0.1mA
*Low temperature working test: -40°C, storage 48 hours
*Constant damp heat test: double 85, 240 hours
*Temperature change: every 5 cycles is 24 hours, 75 days;
*Inductance test: 16uH≤AL≤30uH, (10kHz 0.3V) 8uH≤AL≤15uH, (100kHz 0.3V)
*Mechanical vibration: 10g vibration test

 

Product Parameter
*Material: T2Y2 copper busbar, plastic PPS+GF30 (off-white)
*Core process: stamping, injection molding
*Technical parameters:
*Hot and cold shock conditions: -40℃-85℃, 3 hours per cycle, 100 cycles;
*Insulation resistance: 1000VDC, maintain 60s, insulation greater than 5000MΩ
*Constant damp heat test: double 85, 700 hours
*Temperature change: -40-125°C, 3 hours per cycle, 450 cycles
*Mechanical vibration: 10g vibration test

 

Product Parameter
*Material: T2Y2 copper busbar, plastic PPS+GF30, nanocrystalline magnetic ring
*Core technology: stamping, nanocrystalline magnetic ring primary injection molding, nanocrystalline magnetic ring secondary injection molding
*Technical parameters:
*Hot and cold shock conditions: -40℃-85℃, 3 hours per cycle, 100 cycles;
*High temperature aging: 95℃ high temperature: humidity 50%±25%
*Total test time: 1920H
*Insulation withstand voltage: 3000VAC, maintain 60s, leakage current <0.1mA
*Low temperature working test: -40°C, storage for 24 hours
*Inductance test: AL≥13uH(10kHz 0.1V) AL≥5uH,(100kHz 01V)
*Mechanical vibration: 10g vibration test