Product Parameter
*Material: PBT+silicon steel sheet+copper alloy
*Core technology: core stamping lamination, heat treatment, pin assembly bending, core/pin molding/bushing injection molding
*Technical parameters:
*Hot and cold shock conditions: -40℃-125℃ 168 cycles, series temperature cycle -40℃-125℃ 485 cycles;
*High temperature aging: 125℃ 1340 hours
*Low temperature storage: -40℃ 168 hours
*Temperature and humidity conditions: double 85 240 hours
*Insulation withstand voltage: DC4100V/10s, leakage current ≤0.2mA
*Flame retardant grade: UL94-V0
Product Parameter
*Material: PBT+silicon steel sheet+copper alloy
*Core technology: core stamping lamination, heat treatment, pin assembly bending, core/pin molding/bushing injection molding
*Technical parameters:
*Hot and cold shock conditions: -40℃-125℃ 168 cycles, series temperature cycle -40℃-125℃ 485 cycles;
*High temperature aging: 125℃ 1340 hours
*Low temperature storage: -40℃ 168 hours
*Temperature and humidity conditions: double 85 240 hours
*Insulation withstand voltage: DC4100V/10s, leakage current ≤0.2mA
*Flame retardant grade: UL94-V0
Product Parameter
*Material: PA66+PA6T+silicon steel sheet+T2Y2 copper
*Core technology: magnetic core stamping lamination, heat treatment, copper busbar stamping/bending, copper busbar molding injection molding, magnetic core assembly molding
*Technical parameters:
*Hot and cold shock conditions: -40℃-105℃ 500 cycles
*High temperature aging: 105℃ 1340 hours
*Low temperature storage: -40℃ 168 hours
*Temperature and humidity conditions: double 85 240 hours
*Insulation withstand voltage: AC4500V/60s, leakage current ≤5mA
*Insulation impedance: 1000MΩ, DC500V
*Flame retardant grade: UL94-V0
